Intel C2518 FH8065501516710 Data Sheet

Intel

®

 Atom™ Processor C2000 Product Family for Microserver

September 2014

Datasheet, Vol. 3 of 3

Order Number: 330061-002US

699

This chapter provides the ball-out (also called solder balls, pins, bumps) assignments 

for the SoC. The signal names used here are defined in 

 of this document. The mechanical details of the ball arrangement are in 

The balls with the signal name NC are No-Connect balls. The platform board must not 

make any connections to these balls.

The ball-out assignments are first shown in alphabetical order according to the signal 

name (see 

), and then according to the ball-grid number assignment (see 

 presents the ball map and the physical locations of the 

signals on the ball grid.