Intel C2518 FH8065501516710 Data Sheet

Intel

®

 Atom™ Processor C2000 Product Family for Microserver

September 2014

Datasheet, Vol. 3 of 3

Order Number: 330061-002US

745

The SoC is manufactured as a 34 mm x 28 mm Flip-Chip Ball Grid Array (FCBGA) 

package and consists of a silicon die mounted face down on an organic substrate 

populated with 1283 solder balls on the bottom side. Capacitors are placed on the 

package top side in the area surrounding the die. Because die-side capacitors are 

electrically conductive, and only slightly shorter than the die height, care needs to be 

taken to avoid contacting the capacitors with electrically conductive materials. Doing so 

may short the capacitors and possibly damage the device or render it inactive.

The use of an insulating material between the capacitors and any thermal solution 

needs to be considered to prevent capacitor shorting. An exclusion, or keep out zone, 

surrounds the die and capacitors, and identifies the contact area for the package. Care 

needs to be taken to avoid contact with the package inside this area.

While package drawings are shown in this chapter, refer to the Intel

Design Guide (TMSDG) for details on package mechanical dimensions and tolerance 

and other key package attributes. The drawings shown here are for informational 

purposes and not meant to be the control documents for mechanical details of the 

package.

The following are the dimensions:

• Package parameters: 34 mm x 28 mm
• Ball Count: 1283

34 mm

28 mm