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Intel
Core 2 Duo E7300
User Manual
Intel Core 2 Duo E7300 BX80570E7300 User Manual
Product codes
BX80570E7300
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Thermal and Mechanical Design Guidelines
3
Contents
1
Introduction ...................................................................................................11
1.1
Document Goals and Scope ...................................................................11
1.1.1
Importance of Thermal Management ..........................................11
1.1.2
Document Goals......................................................................11
1.1.3
Document Scope .....................................................................12
1.2
References ..........................................................................................13
1.3
Definition of Terms ...............................................................................13
2
Processor Thermal/Mechanical Information .........................................................15
2.1
Mechanical Requirements ......................................................................15
2.1.1
Processor Package...................................................................15
2.1.2
Heatsink Attach ......................................................................17
2.1.2.1
General Guidelines....................................................17
2.1.2.2
Heatsink Clip Load Requirement..................................17
2.1.2.3
Additional Guidelines.................................................18
2.2
Thermal Requirements ..........................................................................18
2.2.1
Processor Case Temperature .....................................................18
2.2.2
Thermal Profile .......................................................................19
2.2.3
Thermal Solution Design Requirements ......................................19
2.2.4
T
CONTROL
..................................................................................20
2.3
Heatsink Design Considerations..............................................................21
2.3.1
Heatsink Size..........................................................................22
2.3.2
Heatsink Mass.........................................................................22
2.3.3
Package IHS Flatness...............................................................23
2.3.4
Thermal Interface Material........................................................23
2.4
System Thermal Solution Considerations .................................................24
2.4.1
Chassis Thermal Design Capabilities...........................................24
2.4.2
Improving Chassis Thermal Performance ....................................24
2.4.3
Summary...............................................................................25
2.5
System Integration Considerations..........................................................25
3
Thermal Metrology ..........................................................................................27
3.1
Characterizing Cooling Performance Requirements ....................................27
3.1.1
Example ................................................................................28
3.2
Processor Thermal Solution Performance Assessment ................................29
3.3
Local Ambient Temperature Measurement Guidelines.................................29
3.4
Processor Case Temperature Measurement Guidelines ...............................32
4
Thermal Management Logic and Thermal Monitor Feature .....................................33
4.1
Processor Power Dissipation...................................................................33
4.2
Thermal Monitor Implementation ............................................................33
4.2.1
PROCHOT# Signal ...................................................................34
4.2.2
Thermal Control Circuit ............................................................34
4.2.2.1
Thermal Monitor .......................................................34
4.2.3
Thermal Monitor 2 ...................................................................35
4.2.4
Operation and Configuration .....................................................36
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