Intel Core 2 Duo E7300 BX80570E7300 User Manual

32  

 

Thermal and Mechanical Design Guidelines  

To ensure functionality and reliability, the processor is specified for proper operation 

when T

C

 is maintained at or below the thermal profile as listed in the datasheet. The 

measurement location for T

C

 is the geometric center of the IHS. Figure 

location for T

C

 measurement. 

Special care is required when measuring T

C

 to ensure an accurate temperature 

measurement. Thermocouples are often used to measure T

C

. Before any temperature 

measurements are made, the thermocouples must be calibrated, and the complete 

measurement system must be routinely checked against known standards. When 

measuring the temperature of a surface that is at a different temperature from the 

surrounding local ambient air, errors could be introduced in the measurements. The 

measurement errors could be caused by poor thermal contact between the junction of 

the thermocouple and the surface of the integrated heat spreader, heat loss by 

radiation, convection, by conduction through thermocouple leads, or by contact 

between the thermocouple cement and the heatsink base.  

Appendix D defines a reference procedure for attaching a thermocouple to the IHS of 
a 775-Land LGA processor package for T

C

 measurement. This procedure takes into 

account the specific features of the 775-Land LGA package and of the LGA775 socket 

for which it is intended.  

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