Intel Core 2 Duo E7300 BX80570E7300 User Manual

44  

 

Thermal and Mechanical Design Guidelines  

 

0.000

0.050

0.100

0.150

0.200

0.250

0.300

0.350

0.400

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

Reference TMA @ 5300 RPM

Reference TMA @ 2500 RPM

Reference TMA @ 1200 RPM

 

The BTX TMA is integral to the cooling of the processor voltage regulator (VR). The 

reference design TMA will include a flow partitioning device to ensure an appropriate 

airflow balance between the TMA and the VR. In validation the need for this 

component will be evaluated. 

The BTX thermal management strategy relies on the Thermal Module to provide 

effective cooling for the voltage regulator (VR) chipset and system memory 

components on the motherboard. The Thermal Module is required to have features 

that allow for airflow to bypass the heatsink and flow over the VR region on both the 

primary and secondary sides of the board. The following requirements apply to VR 

cooling. 

 

Minimum VR bypass airflow for 
775_VR_CONFIG_06 processors 

2.4 CFM 

NOTES:  

1. 

This is the recommended airflow rate that should be delivered to the VR when the VR 

power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP 

power dissipation and the chassis external environment temperature is at 35 ºC. Less 

airflow is necessary when the VR power is not at a maximum or if the external ambient 

temperature is less than 35 ºC. 

2. 

This recommended airflow rate is based on the requirements for the Intel 965 Express 

Chipset Family.