Intel Core 2 Duo E7300 BX80570E7300 User Manual

Thermal and Mechanical Design Guidelines   

 47 

Each test sequence should start with components (i.e., motherboard, heatsink 

assembly, etc.) that have never been previously submitted to any reliability testing.  

The test sequence should always start with a visual inspection after assembly, and 
BIOS/CPU/Memory test (refer to Section 

6.3.3).  

Prior to the mechanical shock & vibration test, the units under test should be 

preconditioned for 72 hours at 45º C. The purpose is to account for load relaxation 

during burn-in stage. 

The stress test should be followed by a visual inspection and then BIOS/CPU/Memory 

test. 

The post-test pass criteria are: 
1.  No significant physical damage to the heatsink attach mechanism (including such 

items as clip and motherboard fasteners). 

2.  Heatsink must remain attached to the motherboard.  
3.  Heatsink remains seated and its bottom remains mated flatly against IHS surface. 

No visible gap between the heatsink base and processor IHS. No visible tilt of the 

heatsink with respect to its attach mechanism. 

4.  No signs of physical damage on motherboard surface due to impact of heatsink or 

heatsink attach mechanism. 

5.  No visible physical damage to the processor package. 
6.  Successful BIOS/Processor/memory test of post-test samples. 
7.  Thermal compliance testing to demonstrate that the case temperature 

specification can be met. 

Thermal performance degradation due to TIM degradation is evaluated using power 

cycling testing. The test is defined by 7500 cycles for the case temperature from room 

temperature (~23º C) to the maximum case temperature defined by the thermal 

profile at TDP. A Thermal Test Vehicle is used for this test.