Intel Core 2 Duo E7300 BX80570E7300 User Manual

Thermal and Mechanical Design Guidelines   

 57 

Intel recommends evaluation of the heatsink within the specific boundary conditions 
based on the methodology described Section 

6.3 , and using a thermal test vehicle.  

Testing is done on bench top test boards at ambient lab temperature. In particular, for 

the reference heatsink, the Plexiglas* barrier is installed 81.28 mm [3.2 in] above the 
motherboard (refer to Sections 

6.6). 

The test results, for a number of samples, are reported in terms of a worst-case mean 

+ 3 value for thermal characterization parameter using real processors (based on the 

thermal test vehicle correction factors).  

Note:  The above 81.28 mm obstruction height that is used for testing complies with the 

recommended obstruction height of 88.9 mm for the ATX form factor. However, it 
would conflict with systems in strict compliance with the ATX specification which 
allows an obstruction as low as 76.2 mm above the motherboard surface in Area A.  

Structural reliability tests consist of unpackaged, board-level vibration and shock tests 

of a given thermal solution in the assembled state. The thermal solution should meet 

the specified thermal performance targets after these tests are conducted; however, 

the test conditions outlined here may differ from your own system requirements. 

Duration: 10 min/axis, 3 axes 

Frequency Range: 5 Hz to 500 Hz  

Power Spectral Density (PSD) Profile: 3.13 G RMS