Intel N2820 FH8065301616603 Data Sheet
Product codes
FH8065301616603
Datasheet
75
Thermal Management
7.3
Scenario Design Power (SDP)
Scenario Design Power (SDP) is a usage-based design specification, and provides
additional guidance for power constrained platforms. SDP is defined at a specific
scenario workload, temperature and frequency.
additional guidance for power constrained platforms. SDP is defined at a specific
scenario workload, temperature and frequency.
SDP in the processor can either be set statically or dynamically by changing the
POWER_LIMIT (PL1), it is required that the system cooling capability sustainable such
power level. While the SDP specification is characterized at Tj of 80 °C, the functional
limit for the product remains at Tj
POWER_LIMIT (PL1), it is required that the system cooling capability sustainable such
power level. While the SDP specification is characterized at Tj of 80 °C, the functional
limit for the product remains at Tj
MAX
. Customers may choose to have the processor
invoke TCC Activation Throttling at 80 °C, but is not required. The processors that have
SDP specified can still exceed SDP under certain workloads such as TDP workloads. TDP
power dissipation is still possible with the intended usage models, and protection
mechanisms to handle levels beyond cooling capabilities are recommended. Intel
recommends using such thermal control mechanisms to manage situations where
power may exceed the thermal design capability.
SDP specified can still exceed SDP under certain workloads such as TDP workloads. TDP
power dissipation is still possible with the intended usage models, and protection
mechanisms to handle levels beyond cooling capabilities are recommended. Intel
recommends using such thermal control mechanisms to manage situations where
power may exceed the thermal design capability.
Note:
Although SDP is defined at 80 °C, the thermal throttling set point will default to 90 °C,
and may be changed by the BIOS to 80 °C.
and may be changed by the BIOS to 80 °C.
7.4
Thermal Sensors
The processor provides thermal sensors that use ring oscillator based DTS (Digital
Thermal Sensor) to provide more accurate measure of system thermals.
Thermal Sensor) to provide more accurate measure of system thermals.
The processor instantiates multiple digital thermal sensors (one DTS for each processor
core, one for each BIU-Bus Interface Unit, and two for non-core processor) and sensor
grouping configurations are provided to optionally select the maximum of all sensors
for thermal readout and interrupt generation.
core, one for each BIU-Bus Interface Unit, and two for non-core processor) and sensor
grouping configurations are provided to optionally select the maximum of all sensors
for thermal readout and interrupt generation.
DTS output are adjusted for silicon variations. For a given temperature, the output
from DTS is always the same irrespective of silicon.
from DTS is always the same irrespective of silicon.
NOTE: DTS encoding of 127 always represents T
J-MAX
.If T
J-MAX
is at 100
o
C instead of 90
o
C then the encoding
127 from DTS indicates 100
O
C, 137 indicates 90
O
C and so forth.
Table 50. Temperature Reading Based on DTS (If T
J-MAX
=90
C)
DTS Counter Value
Temperature Reading
127
90
C
137
80
C
147
70
C
157
60
C
167
50
C
177
40
C
187
30
C
197
20
C
207
10
C