Intel N2820 FH8065301616603 Data Sheet

Datasheet

79

This section specifies the absolute maximum and minimum storage temperature and 
humidity limits for given time durations. Failure to adhere to the specified limits could 
result in physical damage to the component. If this is suspected, Intel recommends a 
visual inspection to determine possible physical damage to the silicon or surface 
components.

•

Specified temperatures are not to exceed values based on data collected. 
Exceptions for surface mount re-flow are specified by the applicable JEDEC 
standard. Non-adherence may affect processor reliability.

•

Component product device storage temperature qualification methods may follow 
JESD22-A119 (low temperature) and JESD22-A103 (high temperature) standards 
when applicable for volatile memory.

•

Component stress testing is conducted in conformance with JESD22-A104.

•

The JEDEC J-JSTD-020 moisture level rating and associated handling practices 
apply to all moisture sensitive devices removed from the moisture barrier bag.

N2805 - Dual Core

80 °C

4.3 W @ Tj Max

2.5 W @ 60 °C

J2850 - Quad Core Pentium

100 °C

10 W @ Tj Max

-

J1850 - Quad Core Celeron

100 °C

10 W @ Tj Max

-

J1750 - Dual Core Celeron

100 °C

10 W @ Tj Max

-

J2900 - Quad Core Pentium

0 to 105 °C

10 W @ 100 °C

-

J1900 - Quad Core Celeron

0 to 105 °C

10 W @ 100 °C

-

J1800 - Dual Core Celeron

0 to 105 °C

10 W @ 100 °C

-

Tabsolute storage

Device storage temperature when exceeded for 

any length of time.

-25 °C

125 °C

Tshort term storage

The ambient storage temperature and time for 

up to 72 hours.

-25 °C

85 °C

Tsustained storage

The ambient storage temperature and time for 

up to 30 months.

-5 °C

40 °C

RHsustained storage

The maximum device storage relative humidity 

for up to 30 months. 

60% @ 24 °C