Intel Core i7 Processor I7-940 AT80601000921AA User Manual
Product codes
AT80601000921AA
Package Mechanical Specifications
34
Datasheet
3.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
for keep-
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
manufacturing efficiencies but will remain within the component keep-in.
3.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
.
Notes:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the minimum and maximum static force that can be applied by the heatsink and retention solution
to maintain the heatsink and processor interface.
3.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
3.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
3.5
Package Insertion Specifications
The processor can be inserted into and removed from an LGA1366 socket 15 times. The
socket should meet the LGA1366 requirements detailed in the appropriate processor
Thermal and Mechanical Design Guidelines (see
socket should meet the LGA1366 requirements detailed in the appropriate processor
Thermal and Mechanical Design Guidelines (see
)
Table 3-1.
Processor Loading Specifications
Parameter
Maximum
Notes
Static Compressive Load
934 N [210 lbf]
1, 2, 3
Dynamic Compressive Load
1834 N [410 lbf] [max static
compressive + dynamic load]
1, 3, 4
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
70 lbs
-
Tensile
25 lbs
-
Torque
35 in.lbs
-