Intel Core i7 Processor I7-940 AT80601000921AA User Manual

Product codes

AT80601000921AA

Datasheet

7.2

Clock Control and Low Power States.....................................................................89
7.2.1

Thread and Core Power State Descriptions .................................................90

7.2.2

Package Power State Descriptions .............................................................91

7.3

Sleep States .....................................................................................................92

7.4

ACPI P-States (Intel

Turbo Boost Technology) .....................................................92

7.5

Enhanced Intel SpeedStep

Technology ...............................................................93

Boxed Processor Specifications................................................................................95
8.1

Introduction......................................................................................................95

8.2

Mechanical Specifications....................................................................................96
8.2.1

Boxed Processor Cooling Solution Dimensions.............................................96

8.2.2

Boxed Processor Fan Heatsink Weight .......................................................98

8.2.3

Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....98

8.3

Electrical Requirements ......................................................................................98
8.3.1

Fan Heatsink Power Supply ......................................................................98

8.4

Thermal Specifications........................................................................................99
8.4.1

Boxed Processor Cooling Requirements......................................................99

8.4.2

Variable Speed Fan ............................................................................... 101

Figures

1-1

High-Level View of Processor Interfaces ................................................................. 9

2-1

Active ODT for a Differential Link Example ............................................................13

2-2

Input Device Hysteresis ......................................................................................21

2-3

VCC Static and Transient Tolerance Load Lines ......................................................25

2-4

VTT Static and Transient Tolerance Load Line ........................................................27

2-5

VCC Overshoot Example Waveform ......................................................................30

3-1

Processor Package Assembly Sketch.....................................................................31

3-2

Processor Package Drawing (Sheet 1 of 2) ............................................................32

3-3

Processor Package Drawing (Sheet 2 of 2) ............................................................33

3-4

Processor Top-Side Markings ...............................................................................35

3-5

Processor Land Coordinates and Quadrants (Bottom View) ......................................36

6-1

Processor Thermal Profile....................................................................................79

6-2

Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ..........81

6-3

Frequency and Voltage Ordering ..........................................................................83

7-1

Power States.....................................................................................................90

8-1

Mechanical Representation of the Boxed Processor .................................................95

8-2

Space Requirements for the Boxed Processor (side view) ........................................96

8-3

Space Requirements for the Boxed Processor (top view) .........................................97

8-4

Space Requirements for the Boxed Processor (overall view) ....................................97

8-5

Boxed Processor Fan Heatsink Power Cable Connector Description............................98

8-6

Baseboard Power Header Placement Relative to Processor Socket.............................99

8-7

Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ............... 100

8-8

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view).............. 100

8-9

Boxed Processor Fan Heatsink Set Points ............................................................ 101