Intel Core i7 Processor Extreme Edition I7-965 AT80601000918AA User Manual

Product codes
AT80601000918AA
Page of 102
Introduction
10
Datasheet 
The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), 
Streaming SIMD Extensions 3 (SSE3) and Streaming SIMD Extensions 4 (SSE4). The 
processor supports several Advanced Technologies: Intel
®
 64 Technology (Intel
®
 64), 
Enhanced Intel SpeedStep
®
 Technology, Intel
®
 Virtualization Technology (Intel
®
 VT), 
Intel
®
 Turbo Boost Technology, and Intel
®
 Hyper-Threading Technology.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in 
the active state when driven to a low level. For example, when RESET# is low, a reset 
has been requested. Conversely, when VTTPWRGOOD is high, the V
TT
 power rail is 
stable.
‘_N’ and ‘_P’ after a signal name refers to a differential pair.
Commonly used terms are explained here for clarification:
• Intel
®
 Core™ i7 Processor Extreme Edition and Intel
®
 Core™ i7 Processor 
— The entire product, including processor substrate and integrated heat spreader 
(IHS).
• 1366-land LGA package — The Intel Core™ i7 processor Extreme Edition and 
Intel Core™ i7 processor is available in a Flip-Chip Land Grid Array (FC-LGA) 
package, consisting of the processor mounted on a land grid array substrate with 
an integrated heat spreader (IHS).
• LGA1366 Socket — The processor (in the LGA 1366 package) mates with the 
system board through this surface mount, 1366-contact socket.
• DDR3 — Double Data Rate 3 Synchronous Dynamic Random Access Memory 
(SDRAM) is the name of the new DDR memory standard that is being developed as 
the successor to DDR2 SRDRAM.
• Intel
®
 QuickPath Interconnect (Intel QPI)— Intel QPI is a cache-coherent, 
point-to-point link based electrical interconnect specification for Intel processors 
and chipsets.
• Integrated Memory Controller — A memory controller that is integrated into the 
processor die.
• Integrated Heat Spreader (IHS) — A component of the processor package used 
to enhance the thermal performance of the package. Component thermal solutions 
interface with the processor at the IHS surface.
• Functional Operation — Refers to the normal operating conditions in which all 
processor specifications, including DC, AC, signal quality, mechanical, and thermal, 
are satisfied.
• Enhanced Intel SpeedStep
®
 Technology — Enhanced Intel SpeedStep 
Technology allows the operating system to reduce power consumption when 
performance is not needed. 
• Execute Disable Bit — Execute Disable allows memory to be marked as 
executable or non-executable, when combined with a supporting operating system. 
If code attempts to run in non-executable memory the processor raises an error to 
the operating system. This feature can prevent some classes of viruses or worms 
that exploit buffer overrun vulnerabilities and can thus help improve the overall 
security of the system. See the Intel
®
 Architecture Software Developer's Manual 
for more detailed information. Refer to 
http://developer.intel.com/
 for future 
reference on up to date nomenclatures.