Oracle Vacuum Cleaner CPU-56T User Manual

Page of 145
SPARC/CPU−56T
21
Setting/resetting the switches during operation causes board damage. Therefore, check
and change switch settings before you install the board.
Installation
Electrostatic discharge and incorrect board installation and removal can damage
circuits or shorten their life. Therefore:
S Touching the board or electronic components in a non−ESD protected environment
causes component and board damage. Before touching boards or electronic
components, make sure that you are working in an ESD−safe environment.
S When plugging the board in or removing it, do not press or pull on the front panel
but use the handles.
S Before installing or removing an additional device or module, read the respective
documentation.
S Make sure that the board is connected to the VME backplane via all assembled
connectors and that power is available on all power pins.
Power Up
If an unformatted floppy disk resides in a floppy drive connected to the VME board
during power up, the VME board does not boot and the OpenBoot prompt does not
appear. Therefore, never boot the VME board with an unformatted floppy disk
residing in a floppy drive connected to the VME board.
a
Operation
While operating the board ensure that the environmental and power requirements are
met:
S To ensure that the operating conditions are met, forced air cooling is required
within the chassis environment.
S High humdity and condensation on the surface cause short circuits. Only operate
the board above 0
°C. Make sure the board is completely dry and there is no
moisture on any surface before applying power.
Replacement/Expansion
Only replace or expand components or system parts with those recommended by Force
Computers. Otherwise, you are fully responsible for the impact on EMC or any
possible malfunction of the product.