Intel 2 Duo T6400 AW80577GG0412MA Leaflet

Product codes
AW80577GG0412MA
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64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel
®
64 architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware
and software configurations. Consult with your system vendor for more information.
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No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology is a security technology under development by Intel and requires
for operation a computer system with Intel
®
Virtualization Technology, an Intel Trusted Execution Technology-enabled processor, chipset, BIOS, Authenticated Code Modules,
and an Intel or other compatible measured virtual machine monitor. In addition, Intel Trusted Execution Technology requires the system to contain a TPMv1.2 as defined by the
Trusted Computing Group and specific software for some uses. See http://www.intel.com/technology/security/ for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGE-
MENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS
ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting
Intel’s Web site www.intel.com.
 *Other names and brands may be claimed as the property of others.
 Copyright © 2008 Intel Corporation. All rights reserved.
Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Intel Core, Centrino, vPro and Intel Core 2 Duo logo are trademarks of Intel Corporation in the U.S.
and other countries.
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Component/Feature
Functionality
Benefit
45nm, Hafnium Hi-K and Metal Gate 
Transistor Technology
Along with increased transistor count and density, Intel’s
45nm Hafnium-based processor significantly reduces 
electrical leakage and high capacitance that is desirable
for good transistor performance.
Higher performance, lower power dual-core processors than
previous silicon-based, older processor technologies.
Power-Optimized (up to) 1066 MHz 
Front Side Bus
Higher data transfer rate, compared to 800 FSB-based
processors.
Promotes enhanced dual-core performance and responsive-
ness, especially with demanding applications.
Line of 25W TDP CPUs
In addition to the traditional TDP line of dual-core proces-
sors, the new 25W line enables lower thermal design power.
Enables thinner, cooler, and quieter laptops and fully-
featured, dual-core processors.
Intel® Advanced Smart Cache
Intel’s unique shared L2 cache allows both cores access to
shared data, minimizing bus traffic. It also allows one core to 
use the entire cache when the other core is inactive.
Helps improve dual-core CPU performance.
Intel® Intelligent Power Capability
Containing many sub-technologies, designed to provide
optimal performance at low power consumption.
More energy-efficient performance and smarter
battery performance for the dual-core CPU.
Intel® HD Boost
Expedites the rate at which streaming media instructions
can be executed.
Great for multimedia applications such as video editing,
digital photography, and advanced gaming.
Intel® Deep Power Down Technology
Intel® Deep Power Down Technology is a low-power state
that allows both cores and L2 cache to be powered down
when the processor is idle.
Enables Intel® Centrino® 2 processor technology-based
notebooks to use less power while doing more.
Intel® Wide Dynamic Execution
Radix-16 technology divider with four lanes, deeper
buffers, 14 stage efficient pipeline, Micro and Macro Ops
Fusion, Additional ALU, Advanced Branch Prediction, Intel®
64 Architecture.
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Efficient per clock processing. Deep buffers allow processor
to look into program flow for optimized parallel executions.
Intel® Smart Memory Access
Optimizes the available data bandwidth from the memory
subsystem.
Improves system performance by optimizing available band-
width in the system bus and memory subsystems.
Intel® Trusted Execution Technology
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(Requires activation) hardware-based mechanisms that
help protect against software-based attacks.
Provides the confidentiality and integrity of data stored or
created on the client PC.