Kingston Technology 2GB 1066MHz DDR3 ECC CL7 DIMM with Thermal Sensor KVR1066D3E7S/2G Data Sheet

Product codes
KVR1066D3E7S/2G
Page of 2
KVR1066D3E7S/2G
2GB 2Rx8 256M x 72-Bit PC3-8500
CL7 ECC 240-Pin DIMM
DESCRIPTION
This document describes ValueRAM's 256M x 72-bit (2GB)
DDR3-1066 CL7 SDRAM (Synchronous DRAM), 2Rx8  ECC
memory module, based on eighteen 128M x 8-bit FBGA compo-
nents. The SPD is programmed to JEDEC standard latency
DDR3-1066 timing of 7-7-7 at 1.5V. This 240-pin DIMM uses
gold contact fingers. The electrical and mechanical specifica-
tions are as follows:
FEATURES
JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
533MHz fCK for 1066Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 6 (DDR3-1066)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration: Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
On-DIMM thermal sensor (Grade B)
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB: Height 1.18” (30mm), double sided component
Document No. VALUERAM0744-001.B00     08/23/11     Page 1
Memory Module Specifi cations
*Power will vary depending on the SDRAM used.
SPECIFICATIONS
CL(IDD)
7 cycles
Row Cycle Time (tRCmin)
50.63ns (min.)
Refresh to Active/Refresh
110ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
37.5ns (min.)
Power (Operating)
 1.890 W*
UL Rating
94 V - 0
Operating Temperature
0
o
 C to 85
o
 C
Storage Temperature
-55
o
 C to +100
o
 C
Continued >>
Important Information: The module defined in this data sheet is one of several configurations available under
this part number. While all configurations are compatible, the DRAM combination and/or the module height may
vary from what is described here.