Intel Desktop Board DQ43AP BLKDQ43AP User Manual
Product codes
BLKDQ43AP
1
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This
could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system
configuration and operating system.
Desktop PCs with Intel® Standard Manageability and Intel® 64 architecture require a computer system with a processor, chipset, BIOS, enabling software and/or operating system,
Desktop PCs with Intel® Standard Manageability and Intel® 64 architecture require a computer system with a processor, chipset, BIOS, enabling software and/or operating system,
device drivers, and applications designed for these features. Performance will vary depending on your configuration. The original equipment manufacturer must provide Intel®
Trusted Platform Module functionality, which requires an Intel® Trusted Platform Module-supported BIOS. Intel® Trusted Platform Module functionality must be initialized and may
not be available in all countries.
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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved. 0409/BV/MS/PDF
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved. 0409/BV/MS/PDF
321832-001US
Technical Specifications
Processor
Processor Support
• Intel® Core™2 Quad and Intel® Core™2 Duo
processors in the LGA775 package
• Supports Intel® 64 Architecture
Chipset
Intel® Q43 Express Chipset
• Intel® 82Q43 Graphics and Memory Controller
Hub (GMCH)
• Intel® 82801JD I/O Controller Hub (ICH10D)
• Intel® Standard Manageability
Graphics Memory Controller Hub (GMCH)
Graphics Memory Controller Hub (GMCH)
• Designed to support up to 8 GB
1
of system
memory using DDR2 800 / 667 SDRAM
memory
• Intel® Fast Memory Access
• Intel® Graphics Media Accelerator 4500
with DirectX* 10
• DVI and VGA integrated graphics output
Intel® I/O Controller Hub
Intel® I/O Controller Hub
• Three onboard SATA ports including one
internal eSATA (3.0 Gb/s) port
USB 2.0
USB 2.0
Integrated Intel® ICH10D controllers:
• Four back-panel ports (two dual-stack)
• Four additional ports (via two headers)
System BIOS
System BIOS
• 32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
Intel® Rapid BIOS Boot
Intel® Rapid BIOS Boot
• Intel® Rapid BIOS Boot
• Intel® Express BIOS Update support
System Memory
Memory Capacity
• Two 240-pin DIMM connectors supporting
two double-sided DIMMs
Memory Type
Memory Type
• DDR2 800 / 667 SDRAM memory support
• Non-ECC Memory
Memory Modes
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
Memory Voltage
• 1.8 V
Hardware Management Features
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
Intel® 82567LM ENERGY STAR*-ready
Intel® 82567LM ENERGY STAR*-ready
10/100/1000 Network Connection
• High quality and reliability with Intel’s
world-class manufacturing and validation
• Supports Intel® Standard Manageability-based
software and applications with added security
and manageability
Expansion Capabilities
Expansion Capabilities
• Two PCI bus add-in card connectors
• One PCI Express* x1 add-in card connector
Audio
Audio
• 5.1-channel Intel® High Definition Audio codec
Jumpers and Other Connectors
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Three front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
Other Connectors
Other Connectors
• One back-panel parallel port connector
• Two back-panel PS/2 connectors
• One serial header
Mechanical
Board Style
• MicroATX 2.2 compliant
Board Size
Board Size
• 9.6” x 9.6” (24.38cm x 24.38cm)
Baseboard Power Requirements
Baseboard Power Requirements
• ATX12V
Environment
Operating Temperature
• 0° C to +55° C
Storage Temperature
Storage Temperature
• -20° C to +70° C
Regulations and Safety Standards
United States and Canada
CSA/UL 60950-1, First Edition
(Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
IEC 60950-1:2001, First Edition
EMC Regulations
(tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003, Issue-004 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
EN 55022:2006 Class B
Japan
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
KN-22:2005 and KN-24:2005
Taiwan
CNS 13438:2006 Class B
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
Lead-Free: The symbol is used to
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in any
of the raw materials and the end product is not
greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information,
visit www.intel.com/products/
desktop/motherboard
Web site at www.intel.com. For the
most current product information,
visit www.intel.com/products/
desktop/motherboard