Intel Xeon L5520 P4X-DPL5520-226-8M586 User Manual
Product codes
P4X-DPL5520-226-8M586
Boxed Processor Specifications
152
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
8.3.1.1
2U Passive / Active Combination Heat Sink Solution
Active Configuration:
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
LA
temperature of 40
°
C depending on the pedestal chassis layout.
Use of the active configuration in a 2U rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
This thermal solution is for use with 95 W and 130 W TDP processor SKUs.
Passive Configuration:
In the passive configuration it is assumed that a chassis duct will be implemented.
Processors with a TDP of 130 W or 95 W must provide a minimum airflow of 30 CFM at
0.205 in. H
Processors with a TDP of 130 W or 95 W must provide a minimum airflow of 30 CFM at
0.205 in. H
2
O (51 m
3
/hr at 51.1 Pa) of flow impedance. For processors with a TDP of
130 W it is assumed that a 40°C T
LA
is met. This requires a superior chassis design to
limit the T
RISE
at or below 5°C with an external ambient temperature of 35°C. For
processors with a TDP of 95W it is assumed that a 55°C T
LA
is met.
8.3.1.2
Active Heat Sink Solution (Pedestal only)
This active solution is designed to help pedestal chassis users to meet the thermal
processor requirements without the use of chassis ducting. It may be still be necessary
to implement some form of chassis air guide or air duct to meet the T
processor requirements without the use of chassis ducting. It may be still be necessary
to implement some form of chassis air guide or air duct to meet the T
LA
temperature of
49
°
C depending on the pedestal chassis layout. Use of this active solution in a 2U
rackmount chassis has not been validated.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
This thermal solution is for use with processor SKUs no higher than 80W.
8.3.1.3
25.5mm Tall Passive Heat Sink Solution (Blade + 1U + 2U Rack)
Note:
95 W SKU’s using the 25.5 mm Tall passive HS are only intended for use in 1U rack
configurations (Thermal Profile B). For use in 2U configurations see
for
details.
In the Blade, 1U and 2U configurations it is assumed that a chassis duct will be
implemented. Due to the complexity of the number of chassis and baseboard
configurations, several airflow and flow impedance values exist. Please refer to the
Intel® Xeon® Processor 5500 Series Thermal / Mechanical Design Guide for detailed
mechanical drawings and specific airflow and impedance values applicable to your use
conditions. It is recommended that the ambient air temperature outside of the chassis
be kept at or below 35°C.
implemented. Due to the complexity of the number of chassis and baseboard
configurations, several airflow and flow impedance values exist. Please refer to the
Intel® Xeon® Processor 5500 Series Thermal / Mechanical Design Guide for detailed
mechanical drawings and specific airflow and impedance values applicable to your use
conditions. It is recommended that the ambient air temperature outside of the chassis
be kept at or below 35°C.