AMD Sempron 3100+ SDA3100AIP3AX Leaflet
Product codes
SDA3100AIP3AX
30430 Rev. 3.43 October 2004
AMD Athlon™ 64 Processor Power and Thermal Data Sheet
Chapter 3
AMD Sempron™ Desktop Processor
23
Table 20 AMD Sempron™ Processor Thermal/Power Specifications
Parameter/OPN
SDA3100AIP3AX
Model Number
3100+
CPUID 8000_0001h EAX [31:0]
7
00000FC0h
FID/VID Status MaxVID Field
8
04h
FID/VID Status MaxFID Field
8
0Ah
FID/VID Status StartVID Field
8
06h
FID/VID Status StartFID Field
8
0Ah
L2 Cache Size
256 KB
T
CASE
Max
10
70°C
T
CONTROL
Max
11
70°C
Max P-State
1800 MHz
VID_VDD
1.40 V
IDD Max
42.7 A
Thermal Design Power
1
62
W
Thermal Resistance (case-to-ambient)
9
0.45
°C/W
Intermediate P-State #1
N/A
VID_VDD N/A
IDD Max
IDD Max
N/A
Thermal Design Power
1
N/A
Intermediate P-State #2
N/A
VID_VDD N/A
IDD Max
IDD Max
N/A
Thermal Design Power
1
N/A
Intermediate P-State #3
N/A
VID_VDD N/A
IDD Max
IDD Max
N/A
Thermal Design Power
1
N/A
Min P-State
1000 MHz
VID_VDD 1.1
V
IDD Max
16.2 A
Thermal Design Power
1
20 W
Halt/Stop Grant at Max P-State
2
IDDC1 Max
30.0 A
I/O Power
5
2.2
W
Halt/Stop Grant at Min P-State
3
IDDC1 Max
7.0 A
I/O Power
5
2.2
W
S3
4
I/O Power
4,6
160 mW
Notes:
1. Thermal Design Power (TDP) is measured under the conditions of T
CASE
Max, IDD Max, and VDD=VID_VDD,
and include all power dissipated on-die from VDD, VDDIO, VLDT, VTT, and VDDA.
2. Assumes t
CASE
max, VDD, clock divider set to 32.
3. Assumes 50
°C, VDD nom, clock divider set to 32.
4. Assumes 35
°C, VDD, VDDA, and VLDT supplies are off, VDDIO and VTT are powered, memory in self-refresh
mode and DDR SDRAM interface tri-stated except CKE pins.
5. Thermal Design Power for VDDIO, VTT, VLDT, and VDDA power planes only.
6. Thermal Design Power for VDDIO and VTT power planes only.
6. Thermal Design Power for VDDIO and VTT power planes only.