AMD Sempron 3100+ SDA3100AIP3AX Leaflet

 

30430 Rev. 3.43  October 2004 

 

 

October 2004 

3.43 

Added OPN for model 4000+ desktop.

 

October 2004 

3.41 

Added FX-55 OPN. Added desktop OPNs for models 3000+, 3200+, and 
3500+. Documented T

CONTROL

 max parameter for all OPNs. Removed 

chapters 3, 4, and 6. 

August 2004 

3.37 

Added AMD Sempron™ Processor and Mobile AMD Sempron™ 
Processor chapters. Removed model 3100+ 62W OPN. Added DTR 
Model 3700+ OPN. 

July 2004 

3.29 

Added model 3400+ 62W mobile OPN. 

June 2004 

3.25 

Added rev CG 89W model 3500+, 3700+, and 3800+ OPNs. Added FX-
53 939 pin package OPN. Added one decimal precision to some IDD 
numbers. Updated document references. 

May 2004 

3.21 

Added rev CG 35W models 2700+ and 2800+. 

April 2004 

3.19 

Removed rev CG 35W OPN. 

April 2004 

3.17 

Corrected model number formatting for DTR OPNs. 

March 2004 

3.15 

Added rev CG 35W model 2700+ OPN. 

March 2004 

3.13 

Added rev CG model 2800+, 3000+, and 3200+ 89W OPNs. Added FX-
53 940 pin package OPN. Corrected note for C3 state on all 
Power/Thermal Specification tables. Added package drawing references 
for lidless parts in OPN decode section. 

January 2004 

3.11 

Added rev CG entries for existing rev C0 parts. Corrected Max FID code 
for model 3200+ 62W mobile OPN. Updated FX-51 Halt/Stop Grant 
power number. Revised IDD Max and TDP for Intermediate P-state #2 
for 754 pin lidless package Rev C0 DTR Model 3200+. 

January 2004 

3.07 

Added model 3400+ DT and DTR parts. Added model 2800+, 3000+, 
and 3200+ 62W Mobile parts. 

December 2003 

3.06 

Added model 3000+ desktop part. 

November 2003 

3.05 

General clean up. Updated S3 I/O power for non-FX parts. Fixed mobile 
OPN example. Added thermal resistance specifications for all OPNs. 

September 2003 

3.02 

Changed min P-state information to N/A in Table 8, and removed 
unreleased entries from Table 4 and Table 14. 

September 2003 

3.00 

Initial public release.