Intel X5272 AT80573KL0966M Data Sheet

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mounted on a pinless substrate with 771 lands, and includes an integrated heat 
spreader (IHS).

• LGA771 socket – The Dual-Core Intel® Xeon® Processor 5200 Series interfaces 

to the baseboard through this surface mount, 771 Land socket. See the LGA771 
Socket Design Guidelines for details regarding this socket.

• Processor core – Processor core with integrated L1 cache. L2 cache and system 

bus interface are shared between the two cores on the die. All AC timing and signal 
integrity specifications are at the pads of the system bus interface.

• Front Side Bus (FSB) – The electrical interface that connects the processor to the 

chipset. Also referred to as the processor system bus or the system bus. All 
memory and I/O transactions, as well as interrupt messages, pass between the 
processor and chipset over the FSB.

• Dual Independent Bus (DIB) – A front side bus architecture with one processor 

on each of several processor buses, rather than a processor bus shared between 
two processor agents. The DIB architecture provides improved performance by 
allowing increased FSB speeds and bandwidth.

• Flexible Motherboard Guidelines (FMB) – Estimate of the maximum values the 

Dual-Core Intel® Xeon® Processor 5200 Series will have over certain time periods. 
Actual specifications for future processors may differ.

• Functional Operation – Refers to the normal operating conditions in which all 

processor specifications, including DC, AC, FSB, signal quality, mechanical and 
thermal are satisfied.

• Storage Conditions – Refers to a non-operational state. The processor may be 

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 
exposed to free air. Under these conditions, processor lands should not be 
connected to any supply voltages, have any I/Os biased or receive any clocks. 
Upon exposure to “free air” (that is, unsealed packaging or a device removed from 
packaging material) the processor must be handled in accordance with moisture 
sensitivity labeling (MSL) as indicated on the packaging material.

• Priority Agent – The priority agent is the host bridge to the processor and is 

typically known as the chipset.

• Symmetric Agent – A symmetric agent is a processor which shares the same I/O 

subsystem and memory array, and runs the same operating system as another 
processor in a system. Systems using symmetric agents are known as Symmetric 
Multiprocessing (SMP) systems. 

• Integrated Heat Spreader (IHS) – A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 
interface with the processor at the IHS surface.

• Thermal Design Power (TDP) – Processor thermal solutions should be designed 

to meet this target. It is the highest expected sustainable power while running 
known power intensive applications. TDP is not the maximum power that the 
processor can dissipate.

• Intel

64 Architecture – An enhancement to Intel's IA-32 architecture that allows 

the processor to execute operating systems and applications written to take 
advantage of the 64-bit extension technology.

• Enhanced Intel SpeedStep

 Technology – Technology that provides power 

management capabilities to servers and workstations.

• Platform Environment Control Interface (PECI) – A proprietary one-wire bus 

interface that provides a communication channel between Intel processor and 
external thermal monitoring devices, for use in fan speed control. PECI