Intel X5272 AT80573KL0966M Data Sheet

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The Dual-Core Intel® Xeon® Processor E5200 Series and Dual-Core Intel® Xeon® 
Processor L5200 Series supports a single Thermal Profile (see

; 

).With this Thermal Profile, it is expected that the Thermal Control 

Circuit (TCC) would only be activated for very brief periods of time when running the 
most power-intensive applications. Refer to the Dual-Core Intel® Xeon® Processor 
5200 Series Thermal/Mechanical Design Guidelines (TMDG)for details on system 
thermal solution design, thermal profiles and environmental considerations.

The Dual-Core Intel® Xeon® Processor L5238 supports a Thermal Profile with nominal 
and short-term conditions designed to meet NEBS level 3 compliance (see 

Operation at either thermal profile should result in virtually no TCC activation. Refer to 
the Dual-Core Intel® Xeon® Processor 5200 Series in Embedded Thermal/Mechanical 
Design Guidelines (TMDG).

The Dual-Core Intel® Xeon® Processor X5200 Series supports a dual Thermal Profile, 
either of which can be implemented. Both ensure adherence to the Intel reliability 
requirements. Thermal Profile A (see 

) is representative of a 

volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink). 
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be 
activated for very brief periods of time when running the most power intensive 
applications. Thermal Profile B (see 

) is indicative of a constrained 

thermal environment (that is, 1U form factor). Because of the reduced cooling 
capability represented by this thermal solution, the probability of TCC activation and 
performance loss is increased. Additionally, utilization of a thermal solution that does 
not meet Thermal Profile B will violate the thermal specifications and may result in 
permanent damage to the processor. Intel has developed these thermal profiles to 
allow customers to choose the thermal solution and environmental parameters that 
best suit their platform implementation. Refer to the Dual-Core Intel® Xeon® 
Processor 5200 Series Thermal/Mechanical Design Guidelines (TMDG) for details on 
system thermal solution design, thermal profiles and environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP) 
defined in 

 for the Dual-Core Intel® Xeon® Processor E5200 Series, 

for the Dual-Core Intel® Xeon® Processor X5200 Series, and 

 for the Dual-

Core Intel® Xeon® Processor L5200 Series and the associated T

CASE

 values. The lower 

point of the thermal profile is the T

CASE_MAX

 at 0 W power (or no power draw).

Analysis indicates that real applications are unlikely to cause the processor to consume 
maximum power dissipation for sustained time periods. Intel recommends that 
complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 for the Dual-Core Intel® Xeon® Processor E5200 Series, 

 for the Dual-Core Intel® Xeon® Processor X5200 Series,    for the Dual-Core 

Intel® Xeon® Processor L5200 Series instead of the maximum processor power 
consumption. The Thermal Monitor feature is intended to help protect the processor in 
the event that an application exceeds the TDP recommendation for a sustained time 
period. For more details on this feature, refer to 

. To ensure maximum 

flexibility for future requirements, systems should be designed to the Flexible 
Motherboard (FMB) guidelines, even if a processor with lower power dissipation is 
currently planned. Intel® Thermal Monitor 1 and Intel® Thermal Monitor 2 
feature must be enabled for the processor to remain within its specifications.