Intel E5400 AT80571PG0682ML Data Sheet
Product codes
AT80571PG0682ML
Datasheet
5
Figures
Static and Transient Tolerance............................................................... 20
Overshoot Example Waveform ............................................................................. 21
®
Pentium
®
Dual-Core Processor E5000 Series Top-Side Markings Example .............. 38
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Pentium
®
Dual-Core Processor E6000 Series Top-Side Markings Example .............. 39
11 Processor Land Coordinates and Quadrants, Top View ................................................... 40
12 land-out Diagram (Top View – Left Side) ..................................................................... 42
13 land-out Diagram (Top View – Right Side) ................................................................... 43
14 Processor Series Thermal Profile ................................................................................ 77
15 Case Temperature (TC) Measurement Location ............................................................ 78
16 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 80
17 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 82
18 Processor Low Power State Machine ........................................................................... 86
19 Mechanical Representation of the Boxed Processor ....................................................... 91
20 Space Requirements for the Boxed Processor (Side View).............................................. 92
21 Space Requirements for the Boxed Processor (Top View)............................................... 92
22 Overall View Space Requirements for the Boxed Processor............................................. 93
23 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 94
24 Baseboard Power Header Placement Relative to Processor Socket ................................... 95
25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 96
26 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 96
27 Boxed Processor Fan Heatsink Set Points..................................................................... 97
12 land-out Diagram (Top View – Left Side) ..................................................................... 42
13 land-out Diagram (Top View – Right Side) ................................................................... 43
14 Processor Series Thermal Profile ................................................................................ 77
15 Case Temperature (TC) Measurement Location ............................................................ 78
16 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 80
17 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 82
18 Processor Low Power State Machine ........................................................................... 86
19 Mechanical Representation of the Boxed Processor ....................................................... 91
20 Space Requirements for the Boxed Processor (Side View).............................................. 92
21 Space Requirements for the Boxed Processor (Top View)............................................... 92
22 Overall View Space Requirements for the Boxed Processor............................................. 93
23 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 94
24 Baseboard Power Header Placement Relative to Processor Socket ................................... 95
25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 96
26 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 96
27 Boxed Processor Fan Heatsink Set Points..................................................................... 97