Intel Core 2 Extreme QX6850 BX80569QX6850 User Manual

Product codes
BX80569QX6850
Page of 122
Datasheet
111
Balanced Technology Extended (BTX) Boxed Processor Specifications
8
Balanced Technology Extended 
(BTX) Boxed Processor 
Specifications
The processor is offered as an Intel boxed processor. Intel boxed processors are 
intended for system integrators who build systems from largely standard components. 
The boxed processor will be supplied with a cooling solution known as the Thermal 
Module Assembly (TMA). Each processor will be supplied with one of the two available 
types of TMAs – Type I or Type II. This chapter documents motherboard and system 
requirements for both the TMAs that will be supplied with the boxed processor in the 
775-land LGA package. This chapter is particularly important for OEMs that 
manufacture motherboards for system integrators. 
representation of a boxed processor in the 775-land LGA package with a Type I TMA. 
 
illustrates a mechanical representation of a boxed processor in the 775-land 
LGA package with Type II TMA.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and 
inches [in brackets].
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor 
product. These dimensions should not be used as a generic keep-out zone for all 
cooling solutions. It is the system designers’ responsibility to consider their proprietary 
cooling solution when designing to the required keep-out zone on their system 
platforms and chassis. Refer to the appropriate Thermal and Mechanical Design 
Guidelines (see 
) for further guidance.
NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but 
the basic shape and size will remain the same.
Figure 40.
Mechanical Representation of the Boxed Processor with a Type I TMA