Intel Core 2 Extreme QX6850 BX80569QX6850 User Manual

Product codes
BX80569QX6850
Page of 122
Datasheet
119
Balanced Technology Extended (BTX) Boxed Processor Specifications
NOTES:
1.
Set point variance is approximately ±1°C from Thermal Module Assembly to Thermal 
Module Assembly.
If the boxed processor TMA 4-pin connector is connected to a 4-pin motherboard 
header and the motherboard is designed with a fan speed controller with PWM output 
(see CONTROL in 
) and remote thermal diode measurement capability, the 
boxed processor will operate as described in the following paragraphs.
As processor power has increased, the required thermal solutions have generated 
increasingly more noise. Intel has added an option to the boxed processor that allows 
system integrators to have a quieter system in the most common usage. 
The 4-wire PWM controlled fan in the TMA solution provides better control over chassis 
acoustics. It allows better granularity of fan speed and lowers overall fan speed than a 
voltage-controlled fan. Fan RPM is modulated through the use of an ASIC located on 
Figure 47.
Boxed Processor TMA Set Points
Table 41.
TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed 
Processors
Boxed Processor 
TMA Set Point 
(ºC)
Boxed Processor Fan Speed
Notes
X ≤ 23
When the internal chassis temperature is below or equal to this 
set point, the fan operates at its lowest speed. Recommended 
maximum internal chassis temperature for nominal operating 
environment.
1
Y = 29
When the internal chassis temperature is at this point, the fan 
operates between its lowest and highest speeds. 
Recommended maximum internal chassis temperature for 
worst-case operating environment.
 Z ≥ 35.5
When the internal chassis temperature is above or equal to this 
set point, the fan operates at its highest speed.
1
Lower Set Point
Lowest Noise Level
Internal Chassis Temperature (Degrees C)
X
Y
Z
Increasing Fan
Speed & Noise
Higher Set Point
Highest Noise Level