Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
19
LGA1156 Socket
3
LGA1156 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power, and ground contacts. The socket contains
1156 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
processors. The socket provides I/O, power, and ground contacts. The socket contains
1156 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate that is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in
Loading Mechanism (ILM). The ILM design includes a back plate that is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in
.
Figure 3-1. LGA1156 Socket with Pick and Place Cover