Intel Xeon X3440 BX80605X3440 User Manual

30

Thermal/Mechanical Specifications and Design Guidelines

When closed, the load plate applies two point loads onto the IHS at the “dimpled” 
features shown in 

. The reaction force from closing the load plate is 

transmitted to the hinge frame assembly and through the fasteners to the back plate. 
Some of the load is passed through the socket body to the board inducing a slight 
compression on the solder joints.

A pin 1 indicator will be marked on the ILM cover assembly.

The back plate (see 

) is a flat steel back plate with pierced and extruded 

features for ILM attach. A clearance hole is located at the center of the plate to allow 
access to test points and backside capacitors if required. An insulator is pre-applied. A 
notch is placed in one corner to assist in orienting the back plate during assembly. 

The Server ILM back plate is different from the Desktop design. Since Server 

secondary-side clearance of 3.0 mm[0.118 inch] is generally available for leads and 

backside components, so Server ILM back plate is designed with 1.8 mm thickness and 

2.2 mm entire height including punch protrusion length.

Fasteners

Load 
Lever

Load 
Plate

Hinge / 
Frame 
Assy

Shoulder Screw

Pin 1 Indicator

Fasteners

Load 
Lever

Load 
Plate

Hinge / 
Frame 
Assy

Shoulder Screw

Pin 1 Indicator

Die Cut 
Insulator

Pierced & Extruded 
Thread Features

Assembly 
Orientation 
Feature

Die Cut 
Insulator

Pierced & Extruded 
Thread Features

Assembly 
Orientation 
Feature