Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
3
Contents
1
Introduction ..............................................................................................................7
1.1
1.1
References .........................................................................................................7
1.2
Definition of Terms ..............................................................................................8
2
Package Mechanical and Storage Specifications....................................................... 11
2.1
2.1
Package Mechanical Specifications ....................................................................... 11
2.2
Processor Storage Specifications ......................................................................... 16
3
LGA1156 Socket ...................................................................................................... 17
3.1
3.1
Board Layout .................................................................................................... 19
3.2
LGA1156 Socket NCTF Solder Joints..................................................................... 20
3.3
Attachment to Motherboard ................................................................................ 21
3.4
Socket Components........................................................................................... 21
3.5
Package Installation / Removal ........................................................................... 23
3.6
Durability ......................................................................................................... 24
3.7
Markings .......................................................................................................... 25
3.8
Component Insertion Forces ............................................................................... 25
3.9
Socket Size ...................................................................................................... 25
4
Independent Loading Mechanism (ILM)................................................................... 27
4.1
4.1
Design Concept................................................................................................. 27
4.2
Assembly of ILM to a Motherboard....................................................................... 30
4.3
ILM Interchangeability ....................................................................................... 31
4.4
Markings .......................................................................................................... 32
5
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 33
5.1
5.1
Component Mass............................................................................................... 33
5.2
Package/Socket Stackup Height .......................................................................... 33
5.3
Socket Maximum Temperature............................................................................ 33
5.4
Loading Specifications........................................................................................ 34
5.5
Electrical Requirements...................................................................................... 35
5.6
Environmental Requirements .............................................................................. 36
6
Thermal Specifications ............................................................................................ 37
6.1
6.1
Thermal Specifications ....................................................................................... 37
6.2
Processor Thermal Features ................................................................................ 44
6.3
Platform Environment Control Interface (PECI)...................................................... 48
7
Sensor Based Thermal Specification Design Guidance.............................................. 51
7.1
7.1
Sensor Based Specification Overview ................................................................... 51
7.2
Sensor Based Thermal Specification..................................................................... 52
7.3
Thermal Solution Design Process ......................................................................... 54
7.4
Fan Speed Control (FSC) design process............................................................... 56
7.5
System Validation ............................................................................................. 58
8
1U Collaboration Thermal Solution .......................................................................... 59
8.1
8.1
Performance Targets.......................................................................................... 59
8.2
Thermal Solution............................................................................................... 62
8.3
Assembly ......................................................................................................... 63
8.4
Geometric Envelope for 1U Thermal Mechanical Design .......................................... 64
8.5
Thermal Interface Material.................................................................................. 64
9
Thermal Solution Quality and Reliability Requirements............................................ 65
9.1
9.1
Collaboration Heatsink Thermal Verification .......................................................... 65
9.2
Mechanical Environmental Testing ....................................................................... 65