Intel Xeon X3440 BX80605X3440 User Manual

Product codes
BX80605X3440
Page of 106
Thermal/Mechanical Specifications and Design Guidelines
69
Thermal Solution Quality and Reliability Requirements
9.3
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials 
include cellulose materials, animal and vegetable based adhesives, grease, oils, and 
many hydrocarbons. Synthetic materials such as PVC formulations, certain 
polyurethane compositions (such as polyester and some polyethers), plastics that 
contain organic fillers of laminating materials, paints, and varnishes also are 
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.
Material used shall not have deformation or degradation in a temperature life test.
Any plastic component exceeding 25 grams should be recyclable per the European Blue 
Angel recycling standards. 
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS 
compliant. 
Lead (Pb)-free: Lead has not been intentionally added, but lead may still exist as an 
impurity below 1000 ppm. 
RoHS compliant: Lead and other materials banned in RoHS Directive are either 
(1) below all applicable substance thresholds as proposed by the EU or (2) an 
approved/pending exemption applies. 
Note:
RoHS implementation details are not fully defined and may change.
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