Intel Xeon X3440 BX80605X3440 User Manual

Product codes
BX80605X3440
Page of 106
77
Component Suppliers
A
Component Suppliers
Note:
The part numbers listed below identifies the reference components. End-users are 
responsible for the verification of the Intel enabled component offerings with the 
supplier. These vendors and devices are listed by Intel as a convenience to Intel's 
general customer base, but Intel does not make any representations or warranties 
whatsoever regarding quality, reliability, functionality, or compatibility of these devices. 
Customers are responsible for thermal, mechanical, and environmental validation of 
these solutions. This list and/or these devices may be subject to change without notice.
The enabled components may not be currently available from all suppliers. Contact the 
supplier directly to verify time of component availability.
§
Table A-1.
Collaboration Heatsink Enabled Components
Item
Intel PN
AVC
1U heatsink Assembly
E49069-001
SQ41900001
Heatsink Back Plate Assembly
E49060-001
P209000071
Table A-2.  LGA1156 Socket and ILM Components
Item
Intel PN
Foxconn
Molex
Tyco
Lotes
LGA1156 Socket
E51948-002
PE115627-
4041-01F
475961132
2013092-1
N/A
LGA1156 ILM
E36142-002
PT44L11-6401
475969910
2013882-3
ACA-ZIF-078-
T02
1U Back Plate
(with Screws)
E66807-001
PT44P12-6401
N/A
N/A
DCA-HSK-157-
T01
Table A-3.  Supplier Contact Information
Supplier
Contact
Phone
Email
AVC 
(Asia Vital 
Components Co., 
Ltd.)
David Chao
+886 2 2299 6930 x7619
david_chao@avc.com.tw
Foxconn
Julia Jiang
+1 408 919 6178
juliaj@foxconn.com
Lotes Co., Ltd.
Windy Wong
+1 604 721 1259
windy@lotesconn.com
Molex
Carol Liang
+86 21 504 80889 x3301
carol.liang@molex.com
Tyco
Billy Hsieh
+81 44 844 8292
billy.hsieh@tycoelectronics.com