Intel E5504 AT80602000801AA User Manual
Product codes
AT80602000801AA
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
139
Boxed Processor Specifications
8.1.4
Intel Boxed 25.5mm Tall Passive Heat Sink Solution
The boxed 25.5 mm Tall heatsink solution will be available for use with boxed
processors that have TDP’s of 95 W and lower. The 25.5 mm Tall passive solution is
designed to be used in Blades, 1U, and 2U chassis where ducting is present. The use of
a 25.5 mm Tall heatsink in a 2U chassis is recommended to achieve a lower heatsink
T
processors that have TDP’s of 95 W and lower. The 25.5 mm Tall passive solution is
designed to be used in Blades, 1U, and 2U chassis where ducting is present. The use of
a 25.5 mm Tall heatsink in a 2U chassis is recommended to achieve a lower heatsink
T
LA
and a more optimized heatsink design.
is a representation of the heat
sink solution. The retention solution used for these products is called Unified Retention
System (URS).
System (URS).
Figure 8-3. Boxed Passive/Active Combination Heat Sink (with Fan Removed)
Figure 8-4. Intel Boxed 25.5 mm Tall Passive Heat Sink Solution