Intel E5504 AT80602000801AA User Manual

Product codes

AT80602000801AA

Intel

Xeon

Processor 5500 Series Datasheet, Volume 1

Thermal Specifications

6.1

Package Thermal Specifications

The Intel

Xeon

processor 5500 series requires a thermal solution to maintain

temperatures within operating limits. Any attempt to operate the processor outside
these limits may result in permanent damage to the processor and potentially other
components within the system. Maintaining the proper thermal environment is key to
reliable, long-term system operation.

A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Processor 5500 Series Thermal / Mechanical Design Guide (TMDG).

Note:

The boxed processor will ship with a component thermal solution. Refer to

Section 8

for

details on the boxed processor.

6.1.1

Thermal Specifications

To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain within the minimum and maximum case temperature
(T

CASE

) specifications as defined by the applicable thermal profile. See

Table 6-2

and

Figure 6-1

for Intel

Xeon

Processor W5580 (130W TDP);

and

for Intel Xeon processor 5500 series Advanced SKU (95W TDP);

Table 6-7

and

Figure 6-3

for Intel Xeon processor 5500 series Standard/Basic SKUs

(80W TDP);

Table 6-9

and

Figure 6-4

for Intel Xeon processor 5500 series Low Power

SKU (60W TDP);

Table 6-11

and

Figure 6-5

for Intel

Xeon

Processor L5518 (60W

TDP) supporting NEBS thermals;

Table 6-13

and

Figure 6-6

for Intel

Xeon

Processor

L5508 (38W TDP) supporting NEBS thermals. Thermal solutions not designed to
provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to this
processor’s TMDG.

The Intel Xeon processor 5500 series implement a methodology for managing
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and to assure processor reliability. Selection of the appropriate fan
speed is based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI) as described in

Section 6.3

. If PECI is less than

TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but
PECI must remain at or below TCONTROL. If PECI >= TCONTROL, then the case
temperature must meet the Thermal Profile. The temperature reported over PECI is
always a negative value and represents a delta below the onset of thermal control
circuit (TCC) activation, as indicated by PROCHOT# (see

Section 6.2

, Processor

Thermal Features). Systems that implement fan speed control must be designed to use
this data. Systems that do not alter the fan speed only need to guarantee the case
temperature meets the thermal profile specifications.