Sony MZ-R91 User Manual

– 29 –

– 30 –

– 31 –

– 32 –

Ref. No.

Location

D301

B-10

D302

B-9

D303

C-4

D304

B-10

D501

G-10

D600

F-6

D601

F-9

D602

G-6

D603

H-9

D801

E-12

D802

F-12

D803

D-11

D804

F-11

D901

D-7

D902

C-9

D903

E-9

D905

C-11

D906

C-11

D907

D-11

IC301

C-12

IC302

C-13

IC303

B-11

IC304

B-4

IC305

D-13

IC501

F-10

IC502

G-12

IC504

E-11

IC505

E-12

IC601

E-12

IC602

H-9

IC603

G-9

IC604

F-12

IC605

G-9

IC801

H-11

IC802

H-10

IC803

E-11

IC804

G-11

IC901

D-10

IC902

C-10

Q101

B-9

Q102

B-11

Q201

C-10

Q202

B-11

Q301

B-10

Q302

C-13

Q303

B-10

Q305

C-11

Q306

H-9

Q307

C-10

Q308

B-11

Q309

B-10

Q501

E-11

Q601

F-9

Q602

F-9

Q603

G-7

Q604

H-9

Q605

G-9

Q607

H-9

Q801

G-13

Q802

F-13

Q803

F-13

Q804

F-13

Q805

F-13

Q806

F-12

Q807

F-13

Q809

D-11

Q901

C-6

Q902

D-9

Q904

C-11

Q905

C-6

Q906

C-10

Q1001

E-11

• Main board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.

*

 IC502 and IC801 are not replaceable

• Lead Layouts

Lead layout of conventional IC

CSP (chip size package)

Note on Printed Wiring Board:
•

X

: parts extracted from the component side.

•

Y

: parts extracted from the conductor side.

•

x

: parts mounted on the conductor side.

•

z

: Through hole.

•

b

: Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

Caution:
Pattern face side:

Parts on the pattern face side seen from

(Conductor Side)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Component Side) the parts face are indicated.

Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in 

Ω

 and 

1

/

4

 

W or less unless otherwise

specified.

•

%

: indicates tolerance.

•

f

: internal component.

•

C

: panel designation.

•

A

: B+ Line.

• Power voltage is dc 3 V and fed with regulated dc power

supply from external power voltage jack.

• Voltages and waveforms are dc with respect to ground

under no-signal conditions.
no mark : PLAYBACK
(

) : RECORD

∗

: Impossible to measure

• Voltages are taken with a VOM (Input impedance 10 M

Ω

).

Voltage variations may be noted due to normal produc-
tion tolerances.

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc-
tion tolerances.

• Circled numbers refer to waveforms.
• Signal path.

E

: PLAYBACK (ANALOG OUT)

j

: PLAYBACK (ANALOG IN)

l

: RECORD (DEGITAL IN)

• Abbreviation

CND : Canadian model
FR

: French model

HK

: Hong Kong model

JEW : Tourist model

Note: The components identified by mark 

0

 or dotted line

with mark 

0

 are critical for safety.

Replace only with part number specified.

*

 IC502 and IC801 are not replaceable

• The voltage and waveform of CSP (chip size package) can-

not be measured, because its lead layout is different form
that of conventional IC.