Intel i7-960 AT80601002727AA User Manual

Product codes

AT80601002727AA

Datasheet

Contents

Introduction ..............................................................................................................9
1.1

Terminology ..................................................................................................... 10

1.2

References ....................................................................................................... 11

Electrical Specifications ........................................................................................... 13
2.1

Intel® QPI Differential Signaling ......................................................................... 13

2.2

Power and Ground Lands.................................................................................... 13

2.3

Decoupling Guidelines........................................................................................ 13
2.3.1

VCC, VTTA, VTTD, VDDQ Decoupling......................................................... 14

2.4

Processor Clocking (BCLK_DP, BCLK_DN) ............................................................. 14
2.4.1

PLL Power Supply ................................................................................... 14

2.5

Voltage Identification (VID) ................................................................................ 14

2.6

Reserved or Unused Signals................................................................................ 17

2.7

Signal Groups ................................................................................................... 18

2.8

Test Access Port (TAP) Connection....................................................................... 19

2.9

Platform Environmental Control Interface (PECI) DC Specifications........................... 20
2.9.1

DC Characteristics .................................................................................. 20

2.9.2

Input Device Hysteresis .......................................................................... 21

2.10 Absolute Maximum and Minimum Ratings ............................................................. 21
2.11 Processor DC Specifications ................................................................................ 22

2.11.1 DC Voltage and Current Specification ........................................................ 23
2.11.2 VCC Overshoot Specification .................................................................... 29
2.11.3 Die Voltage Validation ............................................................................. 30

Package Mechanical Specifications .......................................................................... 31
3.1

Package Mechanical Drawing............................................................................... 31

3.2

Processor Component Keep-Out Zones................................................................. 34

3.3

Package Loading Specifications ........................................................................... 34

3.4

Package Handling Guidelines............................................................................... 34

3.5

Package Insertion Specifications.......................................................................... 34

3.6

Processor Mass Specification............................................................................... 35

3.7

Processor Materials............................................................................................ 35

3.8

Processor Markings............................................................................................ 35

3.9

Processor Land Coordinates ................................................................................ 36

Land Listing............................................................................................................. 37

Signal Descriptions.................................................................................................. 67

Thermal Specifications ............................................................................................ 71
6.1

Package Thermal Specifications........................................................................... 71
6.1.1

Thermal Specifications ............................................................................ 71

6.1.2

Thermal Metrology ................................................................................. 75

6.2

Processor Thermal Features ................................................................................ 76
6.2.1

Processor Temperature ........................................................................... 76

6.2.2

Adaptive Thermal Monitor........................................................................ 76

6.2.3

THERMTRIP# Signal ............................................................................... 79

6.3

Platform Environment Control Interface (PECI)...................................................... 79
6.3.1

Introduction .......................................................................................... 79

6.3.2

PECI Specifications ................................................................................. 81

6.4

Storage Conditions Specifications ........................................................................ 82

Features .................................................................................................................. 83
7.1

Power-On Configuration (POC) ............................................................................ 83

7.2

Clock Control and Low Power States .................................................................... 83