Intel i7-960 AT80601002727AA User Manual

Datasheet 

93

This section describes the cooling requirements of the fan heatsink solution used by the 

boxed processor.

The boxed processor may be directly cooled with a fan heatsink. However, meeting the 

processor's temperature specification is also a function of the thermal design of the 

entire system, and ultimately the responsibility of the system integrator. The processor 

temperature specification is found in 

 of this document. The boxed processor 

fan heatsink is able to keep the processor temperature within the specifications (see 

) in chassis that provide good thermal management. For the boxed processor 

fan heatsink to operate properly, it is critical that the airflow provided to the fan 

heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the 

sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow 

through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink 

reduces the cooling efficiency and decreases fan life. 

 

illustrate an acceptable airspace clearance for the fan heatsink. The air temperature 

entering the fan should be kept below 40 ºC. Again, meeting the processor's 

temperature specification is the responsibility of the system integrator. 

+12 V: 12 volt fan power supply

10.8

12

13.2

V

-

IC: 

- Peak steady-state fan current draw
- Average steady-state fan current draw

—
—

—
—

3.0
2.0

A
A

-

SENSE: SENSE frequency

—

2

—

pulses per fan 

revolution

1

1. Baseboard should pull this pin up to 5V with a resistor.

CONTROL

21

25

28

kHz

2, 3

2. Open drain type, pulse width modulated.

3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.

B

C

R110

[4.33]