Compaq EV67 User Manual
Alpha 21264/EV67 Hardware Reference Manual
Thermal Management
10–1
10
Thermal Management
This chapter describes the 21264/EV67 thermal management and thermal design
considerations, and is organized as follows:
considerations, and is organized as follows:
•
Operating temperature
•
Heat sink specifications
•
Thermal design considerations
10.1 Operating Temperature
The 21264/EV67 is specified to operate when the temperature at the center of the heat
sink (T
sink (T
c)
is as shown in Table 10–1. Temperature T
c
should be measured at the center of
the heat sink, between the two package studs. The GRAFOIL pad is the interface mate-
rial between the package and the heat sink.
rial between the package and the heat sink.
Note:
Compaq recommends using the heat sink because it greatly improves the
ambient temperature requirement.
ambient temperature requirement.
Table 10–1 Operating Temperature at Heat Sink Center
(T
c
)
T
c
Frequency
80.2
°
C
600 MHz
78.1
°
C
667 MHz
76.9
°
C
700 MHz
76.0
°
C
733 MHz
75.4
°
C
750 MHz
72.7
°
C
833 MHz