Compaq EV67 User Manual
Alpha 21264/EV67 Hardware Reference Manual
Thermal Management
10–7
Thermal Design Considerations
10.3 Thermal Design Considerations
Follow these guidelines for printed circuit board (PCB) component placement:
•
Orient the 21264/EV67 on the PCB with the heat sink fins aligned with the airflow
direction.
direction.
•
Avoid preheating ambient air. Place the 21264/EV67 on the PCB so that inlet air is
not preheated by any other PCB components.
not preheated by any other PCB components.
•
Do not place other high power devices in the vicinity of the 21264/EV67.
Do not restrict the airflow across the 21264/EV67 heat sink. Placement of other devices
must allow for maximum system airflow in order to maximize the performance of the
heat sink.
must allow for maximum system airflow in order to maximize the performance of the
heat sink.