Hynix 8GB DDR3 PC3-8500 User Manuals

Table of Contents

• Description

  3
• Features

  3
• Ordering Information

  3
• Key Parameters

  4
• Speed Grade

  4
• Address Table

  4
• Pin Descriptions

  5
• Input/Output Functional Descriptions

  6
• Pin Assignments

  8
• Functional Block Diagram

  9
• 2GB, 256Mx64 Module(1Rank of x16)

  9
• 4GB, 512Mx64 Module(1Rank of x8)

  10
• 8GB, 1Gx64 Module(2Rank of x8)

  11
• 8GB, 1Gx64 Module(2Rank of x8)

  11
• Absolute Maximum Ratings

  12
  • Absolute Maximum DC Ratings

    12
  • DRAM Component Operating Temperature Range

    12
• AC & DC Operating Conditions

  13
  • Recommended DC Operating Conditions

    13
• AC & DC Input Measurement Levels

  14
  • AC and DC Input Levels for Single-Ended Command and Address Signals

    14
  • AC and DC Input Levels for Single-Ended Signals

    15
• Vref Tolerances

  16
• AC and DC Logic Input Levels for Differential Signals

  17
  • Differential signal definition

    17
  • Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)

    18
  • Single-ended requirements for differential signals

    19
  • Differential Input Cross Point Voltage

    20
  • Slew Rate Definitions for Single-Ended Input Signals

    21
  • Slew Rate Definitions for Differential Input Signals

    22
• AC & DC Output Measurement Levels

  23
  • Single Ended AC and DC Output Levels

    23
  • Differential AC and DC Output Levels

    23
  • Single Ended Output Slew Rate

    24
  • Differential Output Slew Rate

    25
  • Reference Load for AC Timing and Output Slew Rate

    26
• Overshoot and Undershoot Specifications

  27
  • Address and Control Overshoot and Undershoot Specifications

    27
  • Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications

    28
• Refresh parameters by device density

  29
• Standard Speed Bins

  30
  • DDR3-800 Speed Bins

    30
  • DDR3-1066 Speed Bins

    31
  • DDR3-1333 Speed Bins

    32
  • DDR3-1600 Speed Bins

    33
  • Speed Bin Table Notes

    34
• Environmental Parameters

  35
• IDD and IDDQ Specification Parameters and Test Conditions

  36
• IDD Specifications (Tcase: 0 to 95oC)

  48
  • 2GB, 256M x 64 SO-DIMM: HMT425S6MFR6C

    48
  • 4GB, 512M x 64 SO-DIMM: HMT451S6MFR8C

    48
  • 8GB, 1G x 64 SO-DIMM: HMT41GS6MFR8C

    49
• Module Dimensions

  50
  • 256Mx64 - HMT425S6MFR6C

    50
  • 512Mx64 - HMT451S6MFR8C

    51
  • 1Gx64 - HMT41GS6MFR8C

    52