User ManualTable of ContentsIntel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications1Contents3Figures4Tables4Revision History51.0 Introduction61.1 Design Flow6Figure 1. Thermal Design Process71.2 Definition of Terms7Table 1. Definition of Terms (Sheet 1 of 2)71.3 Reference Documents81.4 Thermal Design Tool Availability82.0 Package Information93.0 Thermal Specifications103.1 Thermal Design Power103.2 Maximum Allowed Component Temperature10Table 2. Thermal Specifications for the Intel® Core™2 Duo processor104.0 Mechanical Specifications114.1 Package Mechanical Requirements114.1.1 Die Pressure/Load Upper Limit114.1.2 Die Pressure/Load Lower Limit114.2 Package Keep Out Zones Requirements114.3 Board Level Keep Out Zone Requirements11Figure 2. Primary Side Keep Out Zone Requirements- Micro-FCPGA12Figure 3. Primary Side Keep Out Zone Requirements- Micro-FCBGA13Figure 4. Secondary Side Keep Out Zone Requirements145.0 Thermal Solution Requirements155.1 Thermal Solution Characterization15Figure 5. Processor Thermal Characterization Parameter Relationships165.1.1 Calculating the Required Thermal Performance for the Intel® Core™2 Duo processor16Table 3. Required Heatsink Thermal Performance (YJA)176.0 Reference Thermal Solutions186.1 ATCA Reference Thermal Solution18Figure 6. AdvancedTCA* Reference Heatsink Assembly186.2 Keep Out Zone Requirements196.3 Thermal Performance19Figure 7. AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate196.4 1U+ Reference Heatsink19Figure 8. 1U Reference Heatsink Assembly206.4.1 Keep Out Zone Requirements206.4.2 Thermal Performance20Figure 9. 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate216.5 Compact PCI Reference Heatsink21Figure 10. CompactPCI Reference Heatsink Assembly216.5.1 Keep Out Zone Requirements226.5.2 Thermal Performance22Figure 11. cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate226.6 Heatsink Fastener Assembly226.7 Thermal Interface Material (TIM)226.8 Heatsink Orientation23Figure 12. Heatsink Orientation Relative to Airflow Direction237.0 Thermal Metrology247.1 Die Temperature Measurements247.2 Power Simulation Software247.3 Additional Thermal Features247.4 Local Ambient Temperature Measurement Guidelines247.4.1 Active Heatsink Measurements257.4.2 Passive Heatsink Measurements25Figure 13. Measuring TLA with an Active Heatsink26Figure 14. Measuring TLA with a Passive Heatsink278.0 Reliability Guidelines28Table 4. Reliability Requirements28Appendix A Thermal Solution Component Suppliers29Table 5. Reference Heatsink29Appendix B Mechanical Drawings30Table 6. Mechanical Drawings30Figure 15. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)31Figure 16. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)32Figure 17. AdvancedTCA* Reference Heatsink Assembly33Figure 18. AdvancedTCA* Reference Heatsink34Figure 19. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)35Figure 20. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)36Figure 21. CompactPCI* Reference Heatsink Assembly37Figure 22. CompactPCI* Reference Heatsink38Figure 23. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2)39Figure 24. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2)40Figure 25. 1U Reference Heatsink Assembly41Figure 26. 1U Reference Heatsink42Size: 1.51 MBPages: 42Language: EnglishOpen manual