User ManualTable of ContentsContents3Figures4Tables4Revision History5Introduction7Definition of Terms8Reference Documents8Packaging Technology9Package Mechanical Requirements10Thermal Specifications11Thermal Design Power (TDP)11Die Case Temperature Specifications11Thermal Simulation13Thermal Metrology15Die Case Temperature Measurements15Zero Degree Angle Attach Methodology15Reference Thermal Solution17Operating Environment17Heatsink Performance17Mechanical Design Envelope18Board-Level Components Keep-out Dimensions20Reference Heatsink Thermal Solution Assembly21Heatsink Orientation22Extruded Heatsink Profiles22Mechanical Interface Material23Thermal Interface Material23Effect of Pressure on TIM Performance24Heatsink Clip24Clip Retention Anchors24Reliability Guidelines25Appendix A: Thermal Solution Component Suppliers27Appendix B: Mechanical Drawings29Size: 559 KBPages: 36Language: EnglishOpen manual
User ManualTable of ContentsContents3Figures4Tables4Revision History5Introduction7Definition of Terms8Reference Documents8Packaging Technology9Package Mechanical Requirements10Thermal Specifications11Thermal Design Power (TDP)11Die Case Temperature Specifications11Thermal Simulation13Thermal Metrology15Die Case Temperature Measurements15Zero Degree Angle Attach Methodology15Reference Thermal Solution17Operating Environment17Heatsink Performance17Mechanical Design Envelope18Board-Level Components Keep-out Dimensions20Reference Heatsink Thermal Solution Assembly21Heatsink Orientation22Extruded Heatsink Profiles22Mechanical Interface Material23Thermal Interface Material23Effect of Pressure on TIM Performance24Heatsink Clip24Clip Retention Anchors24Reliability Guidelines25Appendix A: Thermal Solution Component Suppliers27Appendix B: Mechanical Drawings29Size: 559 KBPages: 36Language: EnglishOpen manual