User ManualTable of Contents1 Introduction71.1 Design Flow71.2 Definition of Terms81.3 Reference Documents92 Packaging Technology112.1 Package Mechanical Requirements143 Thermal Specifications153.1 Thermal Design Power (TDP)153.2 Die Case Temperature Specifications154 Thermal Simulation175 Thermal Metrology195.1 Die Case Temperature Measurements195.2 Power Simulation Software216 NB Reference Thermal Solution #1236.1 Operating Environment236.2 Heatsink Performance236.3 Mechanical Design Envelope246.4 Board-Level Components Keepout Dimensions256.5 First NB Heatsink Thermal Solution Assembly266.5.1 Heatsink Orientation276.5.2 Extruded Heatsink Profiles276.5.3 Mechanical Interface Material276.5.4 Thermal Interface Material276.5.5 Heatsink Retaining Fastener286.6 Reliability Guidelines297 NB Reference Thermal Solution #2317.1 Operating Environment317.2 Heatsink Performance317.3 Mechanical Design Envelope327.4 Board-Level Components Keepout Dimensions337.5 Second NB Heatsink Thermal Solution Assembly337.5.1 Heatsink Orientation347.5.2 Extruded Heatsink Profiles347.5.3 Mechanical Interface Material347.5.4 Thermal Interface Material347.5.5 Heatsink Retaining Fastener347.6 Reliability Guidelines358 XMB Reference Thermal Solution378.1 Operating Environment378.2 Heatsink Performance378.3 Mechanical Design Envelope388.4 Board-Level Components Keepout Dimensions388.5 XMB Heatsink Thermal Solution Assembly388.5.1 Heatsink Orientation398.5.2 Extruded Heatsink Profiles408.5.3 Mechanical Interface Material408.5.4 Thermal Interface Material408.5.5 Heatsink Retaining Fastener408.6 Reliability Guidelines41Size: 1.74 MBPages: 54Language: EnglishOpen manual