User Manual (AT80601002274AB)Table of ContentsContents3Figures4Tables5Intel® Xeon® Processor 3500 Series Features6Revision History7Intel® Xeon® Processor 3500 Series11 Introduction91.1 Terminology101.2 References112 Electrical Specifications132.1 Intel® QPI Differential Signaling132.2 Power and Ground Lands132.3 Decoupling Guidelines132.3.1 VCC, VTTA, VTTD, VDDQ Decoupling142.4 Processor Clocking (BCLK_DP, BCLK_DN)142.4.1 PLL Power Supply142.5 Voltage Identification (VID)142.6 Reserved or Unused Signals172.7 Signal Groups182.8 Test Access Port (TAP) Connection192.9 Platform Environmental Control Interface (PECI) DC Specifications202.9.1 DC Characteristics202.9.2 Input Device Hysteresis212.10 Absolute Maximum and Minimum Ratings212.11 Processor DC Specifications222.11.1 DC Voltage and Current Specification232.11.2 VCC Overshoot Specification292.11.3 Die Voltage Validation303 Package Mechanical Specifications313.1 Package Mechanical Drawing313.2 Processor Component Keep-Out Zones343.3 Package Loading Specifications343.4 Package Handling Guidelines343.5 Package Insertion Specifications343.6 Processor Mass Specification353.7 Processor Materials353.8 Processor Markings353.9 Processor Land Coordinates364 Intel® Xeon® Processor 3500 Series Land Listing374.1 Intel Xeon Processor 3500 Series Land Assignments374.1.1 Land Listing by Land Name384.1.2 Land Listing by Land Number565 Signal Definitions755.1 Signal Definitions756 Thermal Specifications796.1 Package Thermal Specifications796.1.1 Thermal Specifications796.1.2 Thermal Metrology836.2 Processor Thermal Features846.2.1 Processor Temperature846.2.2 Adaptive Thermal Monitor846.2.3 THERMTRIP# Signal876.3 Platform Environment Control Interface (PECI)886.3.1 Introduction886.3.2 PECI Specifications896.4 Storage Conditions Specifications907 Features937.1 Power-On Configuration (POC)937.2 Clock Control and Low Power States937.2.1 Thread and Core Power State Descriptions947.2.2 Package Power State Descriptions957.3 Sleep States967.4 ACPI P-States (Intel® Turbo Boost Technology)967.5 Enhanced Intel SpeedStep® Technology978 Boxed Processor Specifications998.1 Introduction998.2 Mechanical Specifications1008.2.1 Boxed Processor Cooling Solution Dimensions1008.2.2 Boxed Processor Fan Heatsink Weight1028.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly1028.3 Electrical Requirements1028.3.1 Fan Heatsink Power Supply1028.4 Thermal Specifications1038.4.1 Boxed Processor Cooling Requirements1038.4.2 Variable Speed Fan105Size: 2.64 MBPages: 106Language: EnglishOpen manual