Microchip Technology 25AA512-I/SN Memory IC SOIC-8 User Manuals

Table of Contents

• Device Selection Table

  1
• Features:

  1
• Pin Function Table

  1
• Description:

  1
• Package Types (not to scale)

  1
• 1.0 Electrical Characteristics

  2
  • Absolute Maximum Ratings (†)

    2
  • TABLE 1-1: DC Characteristics

    2
  • TABLE 1-2: AC Characteristics

    3
  • TABLE 1-3: AC Test Conditions

    5
  • FIGURE 1-1: Hold Timing

    5
  • FIGURE 1-2: Serial Input Timing

    5
  • FIGURE 1-3: Serial Output Timing

    6
• 2.0 Functional Description

  7
  • 2.1 Principles of Operation

    7
  • Block Diagram

    7
  • TABLE 2-1: Instruction Set

    7
    • Read Sequence

      8
  • FIGURE 2-1: Read Sequence

    8
  • 2.2 Write Sequence

    9
  • FIGURE 2-2: Byte Write Sequence

    9
  • FIGURE 2-3: Page Write Sequence

    10
  • 2.3 Write Enable (WREN) and Write Disable (WRDI)

    11
  • FIGURE 2-4: Write Enable Sequence (WREN)

    11
  • FIGURE 2-5: Write Disable Sequence (WRDI)

    11
  • 2.4 Read Status Register Instruction (RDSR)

    12
  • TABLE 2-2: Status Register

    12
  • FIGURE 2-6: Read Status Register Timing Sequence (RDSR)

    12
  • 2.5 Write Status Register Instruction (WRSR)

    13
  • TABLE 2-3: Array Protection

    13
  • FIGURE 2-7: Write Status Register Timing Sequence (WRSR)

    13
  • 2.6 Data Protection

    14
  • 2.7 Power-On State

    14
  • TABLE 2-4: Write-Protect Functionality Matrix

    14
  • 2.8 Page Erase

    15
  • FIGURE 2-8: Page Erase Sequence

    15
  • 2.9 Sector Erase

    16
  • FIGURE 2-9: Sector Erase Sequence

    16
  • 2.10 Chip Erase

    17
  • FIGURE 2-10: Chip Erase Sequence

    17
  • 2.11 Deep Power-Down Mode

    18
  • FIGURE 2-11: Deep Power-Down Sequence

    18
  • 2.12 Release from Deep Power-down and Read Electronic Signature

    19
  • FIGURE 2-12: Release from Deep Power-down and REad Electronic Signature

    19
  • FIGURE 2-13: Release From Deep Power-Down

    19
• 3.0 PIN DESCRIPTIONS

  20
  • TABLE 3-1: Pin Function Table

    20
  • 3.1 Chip Select (CS)

    20
  • 3.2 Serial Output (SO)

    20
  • 3.3 Write-Protect (WP)

    20
  • 3.4 Serial Input (SI)

    20
  • 3.5 Serial Clock (SCK)

    20
  • 3.6 Hold (HOLD)

    20
• 4.0 Packaging Information

  21
  • 4.1 Package Marking Information

    21
    • Revision A

      30
    • Revision B (06/2007)

      30
    • Revision C (10/2007)

      30
    • Revision D (03/2008)

      30
    • Revision E (5/2008)

      30
    • Revision F (05/10)

      30
  • The Microchip Web Site

    31
  • Customer Change Notification Service

    31
  • Customer Support

    31
  • Reader Response

    32
• Trademarks

  35
• Worldwide Sales

  36