AG Neovo TSC-40/IC Manual De Usuario
Document No. DER-S0026A
16
Version 1.2 ©2008 DMC Co., Ltd.
TSC-40/IC Product Specification
80 to 150
°C (Package surface temperature)
260
°C max.
10s max. (Primary + Secondary flow
passage duration)
passage duration)
Time
Te
mpe
rature
110
±30s
175
±15 °C
1 to 4
°C/s
220
°C or above, 60s max.
255
°C or above, 10-16s max.
260
°C max.
Time
Package’
s surface
temperat
u
re
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow)
Frequency:
Three times or less
Temperature:
The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Wave soldering method (Flow soldering, solder dip method)
Frequency:
One time or less
Temperature: Following temperature profile is recommended (Set the optimal preheat temperature
according to the flux type)
Figure 2: Wave soldering temperature profile
3. Soldering iron (Manual soldering)
Soldering bit’s temperature:
370
°C or lower
Soldering time:
Five seconds or less/terminal