Intel i7-975 AT80601002274AA Manual De Usuario
Los códigos de productos
AT80601002274AA
Datasheet
3
Contents
Introduction ..............................................................................................................9
1.1
1.1
Terminology ..................................................................................................... 10
Electrical Specifications ........................................................................................... 13
2.1
2.1
Intel
®
QPI Differential Signaling .......................................................................... 13
Power and Ground Lands.................................................................................... 13
Decoupling Guidelines........................................................................................ 13
2.3.1
2.3.1
Processor Clocking (BCLK_DP, BCLK_DN) ............................................................. 14
2.4.1
2.4.1
Voltage Identification (VID) ................................................................................ 14
Reserved or Unused Signals................................................................................ 17
Signal Groups ................................................................................................... 18
Test Access Port (TAP) Connection....................................................................... 19
Platform Environmental Control Interface (PECI) DC Specifications........................... 20
2.9.1
2.9.1
2.10 Absolute Maximum and Minimum Ratings ............................................................. 21
2.11 Processor DC Specifications ................................................................................ 22
2.11 Processor DC Specifications ................................................................................ 22
2.11.1 DC Voltage and Current Specification ........................................................ 23
2.11.2 VCC Overshoot Specification .................................................................... 29
2.11.3 Die Voltage Validation ............................................................................. 30
2.11.2 VCC Overshoot Specification .................................................................... 29
2.11.3 Die Voltage Validation ............................................................................. 30
Package Mechanical Specifications .......................................................................... 31
3.1
3.1
Land Listing............................................................................................................. 37
Signal Descriptions.................................................................................................. 67
Thermal Specifications ............................................................................................ 71
6.1
6.1
Package Thermal Specifications........................................................................... 71
6.1.1
6.1.1
Thermal Specifications ............................................................................ 71
Thermal Metrology ................................................................................. 75
Processor Temperature ........................................................................... 76