Intel DH55PJ BOXDH55PJ Manual De Usuario

Los códigos de productos
BOXDH55PJ
Descargar
Página de 87
Intel Desktop Board DH55PJ Technical Product Specification 
54 
 
2.6 
Thermal Considerations 
 CAUTION 
Use of a processor heat sink that provides omni-directional airflow to maintain 
required airflow across the processor voltage regulator area is highly recommended. 
 CAUTION 
Failure to ensure appropriate airflow may result in reduced performance of both the 
processor and/or voltage regulator or, in some instances, damage to the board.  For a 
list of chassis that have been tested with Intel desktop boards please refer to the 
following website:   
 
All responsibility for determining the adequacy of any thermal or system design 
remains solely with the reader.  Intel makes no warranties or representations that 
merely following the instructions presented in this document will result in a system 
with adequate thermal performance.
 
 CAUTION 
The ambient temperature must not exceed the board’s maximum operating 
temperature.  Failure to do so could cause components to exceed their maximum case 
temperature and malfunction.  For information about the maximum operating 
temperature, see the environmental specifications in Section 2.8.  
 CAUTION 
Ensure that proper airflow is maintained in the processor voltage regulator circuit.  
Failure to do so may result in damage to the voltage regulator circuit.