Intel DH55PJ BOXDH55PJ Manual De Usuario
Los códigos de productos
BOXDH55PJ
Technical Reference
57
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 50 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 50 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the board is
146,986 hours.
146,986 hours.
2.8
Environmental
Table 31 lists the environmental specifications for the board.
Table 31. Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40
°C to +60 °C
Operating
0 °C to +40 °C
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/sec²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz