Cypress CY7C1473BV33 Manual De Usuario

Descargar
Página de 32
CY7C1471BV33
CY7C1473BV33, CY7C1475BV33
Document #: 001-15029 Rev. *B
Page 23 of 32
Capacitance 
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP 
Package
165 FBGA 
Package
209 BGA 
Package
Unit
C
ADDRESS
Address Input Capacitance
T
A
 = 25
°C, f = 1 MHz,
V
DD
 = 3.3V
V
DDQ 
= 2.5V
6
6
6
pF
C
DATA
Data Input Capacitance
5
5
5
pF
C
CTRL
 
Control Input Capacitance
8
8
8
pF
C
CLK
Clock Input Capacitance
6
6
6
pF
C
I/O
Input/Output Capacitance
5
5
5
pF
Thermal Resistance 
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Max
165 FBGA
Max
209 FBGA
Max
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard 
test methods and procedures for 
measuring thermal impedance, 
according to EIA/JESD51.
24.63
16.3
15.2
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
2.28
2.1
1.7
°C/W
Figure 4.  AC Test Loads and Waveforms
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
L
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
OUTPUT
R = 1667
Ω
R = 1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
L
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load