Cypress CY7C604XX Manual De Usuario
CY7C604XX
Document Number: 001-12395 Rev *H
Page 27 of 30
Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN (001-13191)
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade
device reliability.
the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade
device reliability.
Table 21.Package Handling
Parameter
Description
Minimum
Typical
Maximum
Unit
T
BAKETEMP
Bake Temperature
125
See package label
o
C
T
BAKETIME
Bake Time
See package label
72
hours
001-13191 *C