Cypress CY8C24423A Manual De Usuario
CY8C24223A, CY8C24423A
Document Number: 3-12029 Rev. *E
Page 29 of 31
Figure 18. 28-Pin (210-Mil) SSOP
Thermal Impedances
Capacitance on Crystal Pins
Solder Reflow Peak Temperature
The following table lists the minimum solder reflow peak temperature to achieve good solderability.
51-85079 *C
Table 29. Thermal Impedances per Package
Package
Typical
θ
JA
*
20 SSOP
117
o
C/W
28 SSOP
101
o
C/W
* T
J
= T
A
+ POWER x
θ
JA
Table 30. Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
20 SSOP
2.6 pF
28 SSOP
2.8 pF
Table 31. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
20 SSOP
240
o
C
260
o
C
28 SSOP
240
o
C
260
o
C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with
Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.