Cypress CY8C22113 Manual De Usuario
May 2004
© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E
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4.
Packaging Information
This chapter illustrates the packaging specifications for the CY8C22x13 PSoC device, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
package and the typical package capacitance on crystal pins.
4.1
Packaging Dimensions
Figure 4-1. 8-Lead (300-Mil) PDIP
51-85075 - *A